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Proceedings Paper

Alignment strategies for planarizing technologies
Author(s): Naomasa Shiraishi; Ayako Sugaya; Derek P. Coon
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Paper Abstract

The faculties of current alignment sensors for CMP processes are studied. The alignment sensors are LSA, LIA and FIA, and all of them are currently equipped on Nikon's NSR series. The results showed that those sensors have enough faculties for present CMP processes. For much progressed CMP technologies, we have experimentally made a new alignment sensor and examined it. The new sensor is based on the `Phase Contrast Microscope' and is made by modifying the FIA optics. By using the new sensor, a mark with only 20 nm step height can be clearly detected with higher accuracy than conventional FIA, and the sufficient possibilities of the new concept alignment sensor for the `progressed CMP process' are confirmed.

Paper Details

Date Published: 7 July 1997
PDF: 10 pages
Proc. SPIE 3051, Optical Microlithography X, (7 July 1997); doi: 10.1117/12.276003
Show Author Affiliations
Naomasa Shiraishi, Nikon Corp. (Japan)
Ayako Sugaya, Nikon Corp. (Japan)
Derek P. Coon, Nikon Precision Inc. (United States)

Published in SPIE Proceedings Vol. 3051:
Optical Microlithography X
Gene E. Fuller, Editor(s)

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