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Proceedings Paper

Improving metrology signal-to-noise on grainy overlay features
Author(s): Arnold W. Yanof; Woody Windsor; Russ Elias; John N. Helbert; Cameron Harker
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Paper Abstract

High temperature metal deposition produces large grain size and a highly visible surface morphology due to grain boundaries. When an interconnect layer photoresist pattern is aligned, grainy metal results in noisy signals from optical metrology equipment. The overlay metrology tool hardware and software configuration and target design must be optimized to obtain the best possible signal-to-noise. A powerful metric is developed herein to single out the noise component due to the overlay target image distortions. This methodology is suitable to a production environment. A variety of techniques based upon the target noise metric, including designed experiments, are employed to optimize the overlay measurements configuration.

Paper Details

Date Published: 7 July 1997
PDF: 9 pages
Proc. SPIE 3050, Metrology, Inspection, and Process Control for Microlithography XI, (7 July 1997); doi: 10.1117/12.275960
Show Author Affiliations
Arnold W. Yanof, Motorola (United States)
Woody Windsor, Motorola (United States)
Russ Elias, Motorola (United States)
John N. Helbert, Motorola (United States)
Cameron Harker, KLA Instruments Corp. (United States)


Published in SPIE Proceedings Vol. 3050:
Metrology, Inspection, and Process Control for Microlithography XI
Susan K. Jones, Editor(s)

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