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Proceedings Paper

Effect of processing on the overlay performance of a wafer stepper
Author(s): Peter Dirksen; Casper A. H. Juffermans; A. Leeuwestein; Kees A. H. Mutsaers; Tom A. M. Nuijs; Rudy J. M. Pellens; Robert Wolters; Jack Gemen
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Paper Abstract

The effects of resist spinning, aluminum sputtering and chemical mechanical polishing on the observed alignment position in ASML wafer steppers are presented. Vector maps of the process induced alignment shifts are shown for various processing conditions. The deposition experiments are compared with simulations and a specially designed alignment system modeling program.

Paper Details

Date Published: 7 July 1997
PDF: 12 pages
Proc. SPIE 3050, Metrology, Inspection, and Process Control for Microlithography XI, (7 July 1997); doi: 10.1117/12.275950
Show Author Affiliations
Peter Dirksen, Philips Research Labs. (Netherlands)
Casper A. H. Juffermans, Philips Research Labs. (Netherlands)
A. Leeuwestein, Philips Research Labs. (Netherlands)
Kees A. H. Mutsaers, Philips Research Labs. (Netherlands)
Tom A. M. Nuijs, Philips Research Labs. (Netherlands)
Rudy J. M. Pellens, Philips Research Labs. (Netherlands)
Robert Wolters, Philips Research Labs. (Netherlands)
Jack Gemen, ASM Lithography BV (Netherlands)


Published in SPIE Proceedings Vol. 3050:
Metrology, Inspection, and Process Control for Microlithography XI
Susan K. Jones, Editor(s)

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