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Proceedings Paper

Advanced inspection for 0.25-um-generation semiconductor manufacturing
Author(s): Arye Shapiro; Thomas James; Brian M. Trafas
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Paper Abstract

The goal of SEMATECH Joint Development Project J101 was to accelerate the development of a patterned wafer inspection tool to meet the sensitivity, throughput, and cost requirements for 0.25 micrometers and 0.18 micrometers technology generations. To accomplish this goal, SEMATECH partnered with Tencor Instruments to develop the Tencor Surfscan Advanced Inspection Tool (AIT). This tool is capable of inspecting 100-200 mm wafers with random and repetitive patterns for both particulate contamination and pattern defects. This capability, combined with its high throughput, makes the Surfscan AIT useful as an in-line process monitor. In order to determine its performance on product wafers in a manufacturing environment, a beta version of the AIT system was evaluate at Advanced Micron Devices Fab 25, in Austin, Texas. The evaluation was conducted according to the SEMATECH qualification plan. The final tool development, IRONMAN testing, and beta site evaluation will be described in this paper.

Paper Details

Date Published: 7 July 1997
PDF: 7 pages
Proc. SPIE 3050, Metrology, Inspection, and Process Control for Microlithography XI, (7 July 1997); doi: 10.1117/12.275937
Show Author Affiliations
Arye Shapiro, SEMATECH (United States)
Thomas James, Advanced Micro Devices, Inc. (United States)
Brian M. Trafas, Tencor Instruments (United States)


Published in SPIE Proceedings Vol. 3050:
Metrology, Inspection, and Process Control for Microlithography XI
Susan K. Jones, Editor(s)

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