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Proceedings Paper

Recent advances in 193-nm single-layer photoresists based on alternating copolymers of cycloolefins
Author(s): Francis M. Houlihan; Thomas I. Wallow; Allen G. Timko; E. Neria; Richard S. Hutton; Raymond A. Cirelli; Omkaram Nalamasu; Elsa Reichmanis
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Paper Abstract

We report on our recent investigations on the formulation and processing of 193 nm single layer photoresists based on alternating copolymers of cycloolefins with maleic anhydride. Resists formulated with cycloolefin copolymers are compatible with 0.262 N tetramethylammonium developers, have excellent adhesion, sensitivity, etch resistance and thermal flow properties. The effect of polymer structure and composition, dissolution inhibitor structure and loading as well as the effect of the photoacid generator on the resist dissolution properties was investigated. Based on the results high contrast formulations were evaluated on a GCA XLS (NA equals 0.53, 4X reduction optics) deep-UV stepper to exhibit 0.27 micrometer L/S pair resolution with excellent photosensitivity. Based on the dissolution properties and a spectroscopic examination of the resist, we have designed materials that show less than 0.17 micrometer L/S pair resolution with 193 nm exposures. In this paper, the formulation methodology is detailed and the most recent results upon both with 248 and 193 nm irradiation are described.

Paper Details

Date Published: 7 July 1997
PDF: 8 pages
Proc. SPIE 3049, Advances in Resist Technology and Processing XIV, (7 July 1997); doi: 10.1117/12.275856
Show Author Affiliations
Francis M. Houlihan, Lucent Technologies Bell Labs. (United States)
Thomas I. Wallow, Lucent Technologies Bell Labs. (United States)
Allen G. Timko, Lucent Technologies Bell Labs. (United States)
E. Neria, Lucent Technologies Bell Labs. (United States)
Richard S. Hutton, Lucent Technologies Bell Labs. (United States)
Raymond A. Cirelli, Lucent Technologies Bell Labs. (United States)
Omkaram Nalamasu, Lucent Technologies Bell Labs. (United States)
Elsa Reichmanis, Lucent Technologies Bell Labs. (United States)


Published in SPIE Proceedings Vol. 3049:
Advances in Resist Technology and Processing XIV
Regine G. Tarascon-Auriol, Editor(s)

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