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Proceedings Paper

Effect of polymer structure on dissolution-rate characteristics in carboxylated alicyclic polymers for 193-nm lithography
Author(s): Shigeyuki Iwasa; Katsumi Maeda; Kaichiro Nakano; Etsuo Hasegawa
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Paper Abstract

We characterize the effect of structure on the dissolution rate and adhesion of poly(carboxy-tricyclodecylmethyl methacrylate) which is the base polymer for ArF excimer laser lithography. The adhesion of the polymer decreases with an increase in the protection ratio, and 60% tert-butyl protection causes stripping and collapse of the pattern in 2.38% tetramethylammonium hydroxide (TMAH) developer. We synthesize novel protection groups: menthyl derivatives and a hydroxy-tricyclodecyl (meth)acrylate [TCD(M)AOH] unit, and confirm their improved adhesion and dissolution inhibiting effects in the 2.38% TMAH developer. We obtain a 0.35 micrometer pattern using a resist based on a terpolymer containing TCDAOH and the standard developer.

Paper Details

Date Published: 7 July 1997
PDF: 9 pages
Proc. SPIE 3049, Advances in Resist Technology and Processing XIV, (7 July 1997); doi: 10.1117/12.275812
Show Author Affiliations
Shigeyuki Iwasa, NEC Corp. (Japan)
Katsumi Maeda, NEC Corp. (Japan)
Kaichiro Nakano, NEC Corp. (Japan)
Etsuo Hasegawa, NEC Corp. (Japan)

Published in SPIE Proceedings Vol. 3049:
Advances in Resist Technology and Processing XIV
Regine G. Tarascon-Auriol, Editor(s)

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