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Proceedings Paper

Simulation of resist heating in electron-beam lithography
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Paper Abstract

A mathematical model of resist heating was developed to anticipate the resist temperature rise during electron exposure. This model that takes into consideration the heat propagation in both resist and substrate, each of which may consist of a number of layers. A tabulation of special functions used for numerical calculation allows the analytical solution to be simplified to a single integral for both a variably shaped beam and a Gaussian beam. As a result, a dynamic distribution of a temperature field in resist can be simulated for an exposure process in terms of thickness and characteristics of the resist and multilayer substrate, as well as size, placement, and sequence of flashes. Results of simulations are shown for both short and long exposure periods. It was demonstrated that heat from the substrate does not contribute noticeably at the beginning of the high throughput exposure at 50 kV, whereas heating of the resist itself is significant and highly nonuniform throughout the depth of the resist.

Paper Details

Date Published: 7 July 1997
PDF: 8 pages
Proc. SPIE 3048, Emerging Lithographic Technologies, (7 July 1997); doi: 10.1117/12.275801
Show Author Affiliations
Sergey V. Babin, Etec Systems, Inc. (United States)
Igor Yu. Kuzmin, Set-Service (Russia)


Published in SPIE Proceedings Vol. 3048:
Emerging Lithographic Technologies
David E. Seeger, Editor(s)

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