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Proceedings Paper

Experimental study for thermal postbuckling of isotropic and composite panels with embedded shape memory alloy
Author(s): Ming-Tsang Ho; Roger R. Chen; Li-Chun Chu
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Paper Abstract

Thermal post-buckling behaviors of various passive panels were tested and analyzed. A test fixture was developed for easy installation of the test panels and control of the test conditions. The isotropic test panels were made of aluminum while the composite test panels were of graphite/epoxy type. Both panels with and without embedded shape memory alloy (SMA) strips as the reinforcing elements were tested, compared, and documented. The experimental data were compared with the analysis derived from a finite-element model. It is shown that the passive panels with embedded SMA strips do deform much less than the ones without SMA when temperature rises above the critical buckling point. The post-buckling behaviors of the isotropic panels conform to the analysis given some assumptions about the temperature dependent recovery stress. The composite panels, however, present some complicated thermal buckling modes which are not modeled at this present study. Further research into those complicated mode shapes of the SMA embedded composite panels is suggested.

Paper Details

Date Published: 6 June 1997
PDF: 11 pages
Proc. SPIE 3041, Smart Structures and Materials 1997: Smart Structures and Integrated Systems, (6 June 1997); doi: 10.1117/12.275716
Show Author Affiliations
Ming-Tsang Ho, C & C Technologies, Inc. (United States)
Roger R. Chen, C & C Technologies, Inc. (United States)
Li-Chun Chu, C & C Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 3041:
Smart Structures and Materials 1997: Smart Structures and Integrated Systems
Mark E. Regelbrugge, Editor(s)

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