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Proceedings Paper

Compact integrated piezoelectric vibration control package
Author(s): Ronald L. Spangler; Farla M. Russo; Daniel A. Palombo
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Paper Abstract

Using recent advances in small, surface-mount electronics, coupled with proprietary packaging techniques, ACX has developed the SmartPackTM. The design and realization of this self-contained, active piezoelectric control device are described in this paper. The SmartPack uses a local control architecture, consisting of two parallel, analog, positive position feedback (PPF) filters, along with nearly collocated piezo strain sensors and actuators, to control multiple structural vibration modes. A key issue is the management of waste heat from the power electronics required to drive the piezo actuators. This issue is addressed through thermal/electrical modeling of the packaged amplifier. The effectiveness of the device is demonstrated through multi-mode active damping on a 24 inch square plate.

Paper Details

Date Published: 6 June 1997
PDF: 13 pages
Proc. SPIE 3041, Smart Structures and Materials 1997: Smart Structures and Integrated Systems, (6 June 1997); doi: 10.1117/12.275697
Show Author Affiliations
Ronald L. Spangler, Active Control eXperts, Inc. (United States)
Farla M. Russo, Active Control eXperts, Inc. (United States)
Daniel A. Palombo, Active Control eXperts, Inc. (United States)


Published in SPIE Proceedings Vol. 3041:
Smart Structures and Materials 1997: Smart Structures and Integrated Systems
Mark E. Regelbrugge, Editor(s)

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