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Proceedings Paper

Structuring of dielectric and metallic materials with ultrashort laser pulses between 20 fs and 3 ps
Author(s): Joerg Krueger; Wolfgang Kautek; Matthias Lenzner; Sasa Sartania; Christian Spielmann; Ferenc Krausz
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Paper Abstract

Laser-micromachining of barium aluminum borosilicate glass, fused silica and stainless steel has been extended down to a pulse duration of 20 fs generated by a Ti:sapphire laser system at a wavelength of 0.8 micrometer. A systematic study shows that, below 100 fs, an enhanced precision and a substantial decrease of the ablation threshold fluence in comparison to pulse laser processing with pulses in the picosecond and nanosecond range could be achieved. The physical mechanism and the technical relevance of this novel microtechnology is discussed.

Paper Details

Date Published: 9 May 1997
PDF: 8 pages
Proc. SPIE 2991, Laser Applications in Microelectronic and Optoelectronic Manufacturing II, (9 May 1997); doi: 10.1117/12.273740
Show Author Affiliations
Joerg Krueger, Federal Institute for Materials Research & Testing (Germany)
Wolfgang Kautek, Federal Institute for Materials Research & Testing (Germany)
Matthias Lenzner, Vienna Univ. of Technology (Austria)
Sasa Sartania, Vienna Univ. of Technology (Australia)
Christian Spielmann, Vienna Univ. of Technology (Austria)
Ferenc Krausz, Vienna Univ. of Technology (Austria)


Published in SPIE Proceedings Vol. 2991:
Laser Applications in Microelectronic and Optoelectronic Manufacturing II
Jan J. Dubowski, Editor(s)

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