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Proceedings Paper

Enhanced strength provision for laser-soldered joints in radio electronics
Author(s): Alexander A. Allas; Victor Novosadov
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Paper Abstract

As a result of kinetics of computer simulation of soldered joints forming, practical investigations of soldering modes influence at the joints' strength and analysis of micro section metalographic specimens fulfilled with the aid of electronic microscope, the possibility of three-five fold enhancement of soldered joints strength in comparison with manual soldering. Technological process and automated equipment are developed for laser soldering of electronic components with planar leads at the printed circuit boards.

Paper Details

Date Published: 2 April 1997
PDF: 5 pages
Proc. SPIE 3091, Laser Applications Engineering (LAE-96), (2 April 1997); doi: 10.1117/12.271794
Show Author Affiliations
Alexander A. Allas, TRIZ Ctr. Tvortchestvo (Russia)
Victor Novosadov, Moscow Academy of Food Production (Russia)


Published in SPIE Proceedings Vol. 3091:
Laser Applications Engineering (LAE-96)
Vadim P. Veiko, Editor(s)

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