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Proceedings Paper

Design and fabrication of optoelectronic multichip module prototypes using MEMS fabrication techniques
Author(s): Seungug Koh; Daniel J. Sadler; Kwang Wook Oh; Kenneth P. Roenker; Chong Hyuk Ahn
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Paper Abstract

This paper describes the design, fabrication, and assembly issues of OE-MSMs using MEMS fabrication techniques by characterizing some of the basic building blocks like micromachined silicon mirrors, GaAs MSM photodiodes. Issues of aligning and bonding discrete components discrete components on OE-MCMs are addressed along with the proposed fabrication and packaging strategies. The CMOS compatible TMAH processes are investigated with results comparable to those obtained from KOH processes. After sputtered aluminum layers are applied, the micromachined silicon mirror reflectivities are further improved with some samples showing reflectivities above 95 percent at wavelengths of 1300 nm and 1500 nm. The results from silicon mirror beam profiling and the minor impacts of packaging processes to silicon mirror I/O coupling efficiencies indicate that the mass fabrication of OE-MCM is technically and economically feasible.

Paper Details

Date Published: 11 April 1997
PDF: 9 pages
Proc. SPIE 3008, Miniaturized Systems with Micro-Optics and Micromechanics II, (11 April 1997); doi: 10.1117/12.271439
Show Author Affiliations
Seungug Koh, Univ. of Dayton (United States)
Daniel J. Sadler, Univ. of Cincinnati (United States)
Kwang Wook Oh, Univ. of Cincinnati (United States)
Kenneth P. Roenker, Univ. of Cincinnati (United States)
Chong Hyuk Ahn, Univ. of Cincinnati (United States)


Published in SPIE Proceedings Vol. 3008:
Miniaturized Systems with Micro-Optics and Micromechanics II
M. Edward Motamedi; Larry J. Hornbeck; Kristofer S. J. Pister, Editor(s)

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