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Proceedings Paper

Wafer level thin-film solder bonding of a hybrid sensor for interfacial force microscopy
Author(s): Carolyn M. Matzke; Jack E. Houston
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Paper Abstract

We discuss the design, fabrication and performance of a hybrid force sensor for Interfacial Force Microscopy which features a new wafer-level, thin-film soldering technique.

Paper Details

Date Published: 15 April 1997
PDF: 8 pages
Proc. SPIE 3009, Micromachining and Imaging, (15 April 1997); doi: 10.1117/12.271225
Show Author Affiliations
Carolyn M. Matzke, Sandia National Labs. (United States)
Jack E. Houston, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 3009:
Micromachining and Imaging
Terry A. Michalske; Mark A. Wendman, Editor(s)

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