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Proceedings Paper

Micromachined probes for high-frequency scanning force microscopy and scanning thermal microscopy
Author(s): Michael Stopka; Stefan Muenster; T. Leinhos; Christopher Mihalcea; Wenzel Scholz; A. Leyk; W. Mertin; Egbert Oesterschulze
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Paper Abstract

The spatial and time resolved characterization of electronic devices by scanning probe microscopy demands the fabrication of proximal probes with well defined properties. To fulfill these requirements micromachining is the most appropriate technique, as it allows probe fabrication in a batch process with highest reproducibility. In this paper we describe the development of electrical and thermal near-field probes which can be employed for high frequency scanning force microscopy (HFSFM) and scanning thermal microscopy (SThM) respectively. Both probes have been completely fabricated in a micromachining batch process based on an almost identical technological design. For electrical imaging by HFSFM a coplanar wave guide probe was developed. The probes wave guide properties have been characterized by network analysis. A novel thermal probe consisting of a Schottky diode at the tip of a silicon cantilever was developed for SThM. Preliminary results on electrical and thermal characterization will be presented.

Paper Details

Date Published: 15 April 1997
PDF: 9 pages
Proc. SPIE 3009, Micromachining and Imaging, (15 April 1997); doi: 10.1117/12.271217
Show Author Affiliations
Michael Stopka, Univ. of Kassel (Germany)
Stefan Muenster, Univ. of Kassel (Germany)
T. Leinhos, Univ. of Kassel (Germany)
Christopher Mihalcea, Univ. of Kassel (Germany)
Wenzel Scholz, Univ. of Kassel (Germany)
A. Leyk, Gerhard-Mercator-Univ.-Gh Duisburg (Germany)
W. Mertin, Gerhard-Mercator-Univ.-Gh Duisburg (Germany)
Egbert Oesterschulze, Univ. of Kassel (Germany)

Published in SPIE Proceedings Vol. 3009:
Micromachining and Imaging
Terry A. Michalske; Mark A. Wendman, Editor(s)

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