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Proceedings Paper

Optical submount development for high-reliability/performance applications
Author(s): Chad Noddings; Scott Rattan; Al Russo
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Paper Abstract

MCC is currently applying a previously developed and patented optical submount approach for use in high- reliability/performance applications that include space, airframe, and outside telecommunication systems. The optical submount utilizes a novel alignment method integrated with low-cost, few-chip module packaging techniques originally developed for a laminate multichip module parallel link using vertical cavity surface emitting laser/optical electrical integrated circuit receiver arrays. This system is now being investigated for use in both single and parallel channel high-reliability/performance applications.

Paper Details

Date Published: 4 April 1997
PDF: 4 pages
Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); doi: 10.1117/12.271110
Show Author Affiliations
Chad Noddings, Microelectronics and Computer Technology Corp. (United States)
Scott Rattan, Microelectronics and Computer Technology Corp. (United States)
Al Russo, Microelectronics and Computer Technology Corp. (United States)

Published in SPIE Proceedings Vol. 3005:
Optoelectronic Interconnects and Packaging IV
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

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