Share Email Print

Proceedings Paper

Alignment-tolerant lasers and silicon waferboard integration
Author(s): Mario Dagenais; Vijayanand Vusirikala; Scott A. Merritt; Simarjeet S. Saini; Robert E. Bartolo; Dennis Stone
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Intrinsically large mode semiconductor lasers and mode transformers monolithically integrated with semiconductor lasers, are two promising approaches for making alignment tolerant structures that can be used for passive alignment to single mode optical fibers. This technique, in conjunction with a recently developed silicon waferboard integration scheme, will significantly simplify the assembly process and the packaging of transmitter laser arrays. The passive alignment technique consists of octagonal electrodeposited copper bosses to physically register the laser chip with percussion etched inverted pyramidal receptacles and v-grooves in a silicon substrate.

Paper Details

Date Published: 4 April 1997
PDF: 10 pages
Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); doi: 10.1117/12.271109
Show Author Affiliations
Mario Dagenais, Univ. of Maryland/College Park (United States)
Vijayanand Vusirikala, Univ. of Maryland/College Park (United States)
Scott A. Merritt, Univ. of Maryland/College Park (United States)
Simarjeet S. Saini, Univ. of Maryland/College Park (United States)
Robert E. Bartolo, Univ. of Maryland/College Park (United States)
Dennis Stone, Univ. of Maryland/College Park (United States)

Published in SPIE Proceedings Vol. 3005:
Optoelectronic Interconnects and Packaging IV
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

© SPIE. Terms of Use
Back to Top