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Proceedings Paper

Design and fabrication of passive optical polymer waveguide components for multimode parallel optical links
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Paper Abstract

The development of multimode passive polymer optical waveguide components for board and backplane interconnect applications, such as in the DARPA-sponsored, polymer optical interconnect technology (POINT) program, require several optics design issues to be addressed including efficiency and modal noise. For example, the mating of arrays of sources, detectors, and fibers requires appropriate fanout structures to match the component pitch. Here we consider designs for such structures employing multimode polymer waveguides, including both abrupt and smooth bending elements. We investigate these structures using a new multimode BPM simulation CAD tool, and consider the bend losses as a function of geometry, angle, and source condition. The results are compared with experimental observations on devices fabricated for use in the POINT demonstration module. The simulation closely matches the experiment, demonstrating the utility of such efforts in practical component development.

Paper Details

Date Published: 4 April 1997
PDF: 9 pages
Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); doi: 10.1117/12.271094
Show Author Affiliations
Robert Scarmozzino, Columbia Univ. (United States)
Richard M. Osgood, Columbia Univ. (United States)
Louay A. Eldada, AlliedSignal Inc. (United States)
James T. Yardley, AlliedSignal Inc. (United States)
Yue Liu, Honeywell Technology Ctr. (United States)
Julian P. G. Bristow, Honeywell Technology Ctr. (United States)
Jared D. Stack, AMP, Inc. (United States)
John R. Rowlette, AMP, Inc. (United States)
Yung-Sheng Liu, GE Corporate Research and Development Ctr. (United States)


Published in SPIE Proceedings Vol. 3005:
Optoelectronic Interconnects and Packaging IV
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

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