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Proceedings Paper

New processing approach for grafting optoelectronic devices and applications to multichip modules
Author(s): Charles B. Morrison; Ronald L. Strijek; James H. Bechtel
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Paper Abstract

Epitaxial liftoff and grating of multiple thin integrated circuit-sized semiconductor films each containing over a hundred discrete devices confirms that multichip modules can be produced using this technology. the use of epitaxial liftoff membranes containing electronic and optoelectronic circuits and devices will provide (1) highly improved thermal management, (2) much higher density packaging, and (3) applications polylithically interconnecting electronic mixed-signal and optoelectronic devices. Bond strength data of thin epitaxial membranes grafted onto high thermal conductivity substrates quantifies for the first time to our knowledge the adhesion quality of van der Waals forces. In addition, the handling of very small discrete devices by means of integrated circuit-sized thin films permits the use of commercial off-the-shelf hardware in the development of an automated manufacturing assembly tool. This enabling technology will provide a manufacturing path to continue to commercialize new models of high performance optoelectronic modules with advanced features including higher data rates and increased function.

Paper Details

Date Published: 4 April 1997
PDF: 8 pages
Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); doi: 10.1117/12.271079
Show Author Affiliations
Charles B. Morrison, TACAN Corp. (United States)
Ronald L. Strijek, TACAN Corp. (United States)
James H. Bechtel, TACAN Corp. (United States)


Published in SPIE Proceedings Vol. 3005:
Optoelectronic Interconnects and Packaging IV
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

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