Share Email Print
cover

Proceedings Paper

Recent progress in short-distance optical interconnects
Author(s): Julian P. G. Bristow; John A. Lehman; Yue Liu; Mary K. Hibbs-Brenner; Lynn M. Galarneau; Robert A. Morgan
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Short distance optical interconnects are under development for a range of applications including local area networks, optical backplanes, and optoelectronic accelerators or signal processors. In some applications, the aggregate bandwidth required cannot be provided with electrical interconnects, offering an obvious advantage for optics, while in others it is the density of available interconnects which motivates the use of optics. In most commercial applications, it is the cost of the interconnect solution which will affect its acceptance by system integrator. For optics to be applied in a broad range of applications, greater transparency must be provided to the system integrator. We describe both intercabinet and intracabinet interconnects in which the addition of optical interconnects has been designed to perturb the overall system as little as possible and yet still take advantage of optics.

Paper Details

Date Published: 4 April 1997
PDF: 8 pages
Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); doi: 10.1117/12.271078
Show Author Affiliations
Julian P. G. Bristow, Honeywell Technology Ctr. (United States)
John A. Lehman, Honeywell Technology Ctr. (United States)
Yue Liu, Honeywell Technology Ctr. (United States)
Mary K. Hibbs-Brenner, Honeywell Technology Ctr. (United States)
Lynn M. Galarneau, Honeywell Technology Ctr. (United States)
Robert A. Morgan, Honeywell Technology Ctr. (United States)


Published in SPIE Proceedings Vol. 3005:
Optoelectronic Interconnects and Packaging IV
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

© SPIE. Terms of Use
Back to Top