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Proceedings Paper

Low-power multichip module and board-level links for data transfer
Author(s): Richard Franklin Carson; Terry L. Hardin; Mial E. Warren; Kevin L. Lear; Michael L. Lovejoy; Pamela K. Seigal; David C. Craft; Paul J. Enquist
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Paper Abstract

Advanced device technologies such as vertical cavity surface emitting lasers (VCSELs) and diffractive micro lenses can be combined with novel packaging techniques to allow low-power interconnection of parallel optical signals. These interconnections can be realized directly on circuit boards, in a multi-chip module format, or in packages that emulate electrical connectors. For applications such as stacking of multi-chip module (MCM) layers, the links may be realized in bi-directional form using integrated diffractive microlenses. In the stacked MCM design, consumed electrical power is minimized by use of a relatively high laser output from high efficiency VCSELs, and a receiver design that is optimized for low power, at the expense of dynamic range. WIthin certain constraints, the design may be extended to other forms such as board-level interconnects.

Paper Details

Date Published: 4 April 1997
PDF: 11 pages
Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); doi: 10.1117/12.271077
Show Author Affiliations
Richard Franklin Carson, Sandia National Labs. (United States)
Terry L. Hardin, Sandia National Labs. (United States)
Mial E. Warren, Sandia National Labs. (United States)
Kevin L. Lear, Sandia National Labs. (United States)
Michael L. Lovejoy, Sandia National Labs. (United States)
Pamela K. Seigal, Sandia National Labs. (United States)
David C. Craft, Sandia National Labs. (United States)
Paul J. Enquist, Research Triangle Institute (United States)


Published in SPIE Proceedings Vol. 3005:
Optoelectronic Interconnects and Packaging IV
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

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