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Proceedings Paper

Methods to control plasma parameters in experiments on pulsed laser deposition of carbon films
Author(s): Maria A. Stepanova; Vladimir N. Anisimov; Oleg N. Derkach; Valeria G. Grishina; Andrey Yu. Sebrant
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Paper Abstract

Studies of laser pulsed deposition of thin films show that introduction of an obstacle like a grid screen into ablation plume substantially affects dynamics of plasma expansion and results in dramatic changes of plasma parameters. Two regimes of plasma-grid interaction have been studied in detail -- regime of the free-molecular flow and the throttling. The grid screen may break plasma plume into several interacting with each other flows. Some features of plasma-grid interaction (like transformation of velocity distribution function and variation of plasma temperature and density) can be attributed to the interaction of plasma flow with the generated shock wave. Different dimensional effects controlling plasma-grid interaction have been considered. We report the effect of velocity distribution transformation on the stage of interaction between multiple plasma flows behind the screen. Two modes of such transformation have been observed: linear growth of density in the resulting flow, and formation of the additional slow peak in the velocity distribution. We associate these two modes of transformation with two different regimes of plasmas interaction -- with regime of lateral loss reduction, and regime of expansion in the background gas.

Paper Details

Date Published: 27 March 1997
PDF: 11 pages
Proc. SPIE 2993, Lasers as Tools for Manufacturing II, (27 March 1997); doi: 10.1117/12.270033
Show Author Affiliations
Maria A. Stepanova, Resonetics, Inc. (United States)
Vladimir N. Anisimov, Troitsk Kurchatov Research Institute (Russia)
Oleg N. Derkach, Troitsk Kurchatov Research Institute (Russia)
Valeria G. Grishina, Troitsk Kurchatov Research Institute (Russia)
Andrey Yu. Sebrant, Troitsk Kurchatov Research Institute (Russia)


Published in SPIE Proceedings Vol. 2993:
Lasers as Tools for Manufacturing II
Leonard R. Migliore; Ronald D. Schaeffer, Editor(s)

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