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Proceedings Paper

Processing parameters for laser micromachining
Author(s): James Angell; Wen Ho; Jeffrey S. Bernstein; Ronald D. Schaeffer
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Paper Abstract

Over a period of many years a wealth of information has been accumulated on processing parameters for laser micromachining of different materials. This information includes threshold fluences, etch rates versus fluence curves, taper effects, debris minimization and assist gas effects to name a few. It is the intent of the authors to compile this empirical information into an easily accessible catalog to be used as a reference guide for those interested in laser micromachining. Information will be included on material type, lasers used in machining (carbon-dioxide, solid state, excimer), laser processing parameters (wavelength, fluence, pulse width, cutting speed) and other material related information (thickness, feature sizes, etc.).

Paper Details

Date Published: 27 March 1997
PDF: 10 pages
Proc. SPIE 2993, Lasers as Tools for Manufacturing II, (27 March 1997); doi: 10.1117/12.270015
Show Author Affiliations
James Angell, Resonetics, Inc. (United States)
Wen Ho, Resonetics, Inc. (United States)
Jeffrey S. Bernstein, Resonetics, Inc. (United States)
Ronald D. Schaeffer, Resonetics, Inc. (United States)


Published in SPIE Proceedings Vol. 2993:
Lasers as Tools for Manufacturing II
Leonard R. Migliore; Ronald D. Schaeffer, Editor(s)

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