Share Email Print

Proceedings Paper

Measuring thermal conductivity and diffusivity by holographic interferometry
Author(s): Kang Ming Leung; Bao Chen Liu; Shuit-Tong Lee; A. Cheung; Y. W. Lam
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Knowledge of the thermal conductivity and the thermal diffusivity are the two most important properties for thermal management in microelectronics design. However, it is difficult to measure the thermal conductivity of ordinary bulk materials accurately, especially of materials that have extremely high values such as copper (4 W/cm.K) and diamond (10 to 25 W/cm.K). In this paper, we proposed and demonstrated three methods for measuring the thermal conductivity of bulk materials based on the nondestructive testing technique in holographic interferometry. Their efficacy for measuring high thermal conductivity values of diamond materials is analyzed. We have obtained values of thermal conductivity for aluminum alloy, copper alloy and pure copper, and molybdenum using these methods. The result from one of these methods shows that it is feasible to achieve such measurements for diamond and diamond-like materials. However, to determine the thermal conductivity of diamond materials the method requires that the thermal diffusivity of the sample must be first measured under high thermal excitation. It is also necessary to capture the dynamic thermal process within a fraction of a second.

Paper Details

Date Published: 20 March 1997
PDF: 6 pages
Proc. SPIE 2921, International Conference on Experimental Mechanics: Advances and Applications, (20 March 1997); doi: 10.1117/12.269803
Show Author Affiliations
Kang Ming Leung, City Univ. of Hong Kong (Hong Kong)
Bao Chen Liu, Tsinghwa Univ. (China)
Shuit-Tong Lee, City Univ. of Hong Kong (Hong Kong)
A. Cheung, City Univ. of Hong Kong (Hong Kong)
Y. W. Lam, City Univ. of Hong Kong (Hong Kong)

Published in SPIE Proceedings Vol. 2921:
International Conference on Experimental Mechanics: Advances and Applications
Fook Siong Chau; C. T. Lim, Editor(s)

© SPIE. Terms of Use
Back to Top