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Proceedings Paper

Projection moire for 3D inspection of printed circuit boards
Author(s): Seung-Woo Kim; Yi-Bae Choi; Jung-Taek Oh
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Paper Abstract

We present a method of projection moire specially devised for the three-dimensional inspection of printed circuit boards. This method incorporates phase-shifting technique in analyzing moire fringes so as to achieve a fine resolution of 1 micron in height measurement. Further a synchronous grating translation scheme enhances the lateral measuring resolution by inherently removing the original pattern of the reference grating in resulting moire fringes. Finally we discuss the advantages of the proposed method using several measurement results performed on the various types of solder paste silk-screened on printed circuit boards.

Paper Details

Date Published: 21 March 1997
PDF: 10 pages
Proc. SPIE 3023, Three-Dimensional Image Capture, (21 March 1997); doi: 10.1117/12.269750
Show Author Affiliations
Seung-Woo Kim, Korea Advanced Institute of Science and Technology (South Korea)
Yi-Bae Choi, Korea Advanced Institute of Science and Technology (South Korea)
Jung-Taek Oh, Korea Advanced Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 3023:
Three-Dimensional Image Capture
Richard N. Ellson; Joseph H. Nurre, Editor(s)

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