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Proceedings Paper

Wafer bonding technology and its optoelectronic applications
Author(s): Yu-Hwa Lo; Zuhua Zhu; Yi Qian; Felix Ejike Ejeckam; Gina L. Christenson
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Paper Abstract

This paper describes the wafer bonding technology and its applications to optoelectronic devices and circuits. It shows that the wafer bonding technology can create new device structures with unique characteristics and can form integrated optoelectronic circuits containing optical, electronic and micro-mechanical devices.

Paper Details

Date Published: 22 January 1997
PDF: 10 pages
Proc. SPIE 3006, Optoelectronic Integrated Circuits, (22 January 1997); doi: 10.1117/12.264243
Show Author Affiliations
Yu-Hwa Lo, Cornell Univ. (United States)
Zuhua Zhu, Cornell Univ. (United States)
Yi Qian, Cornell Univ. (United States)
Felix Ejike Ejeckam, Cornell Univ. (United States)
Gina L. Christenson, Cornell Univ. (United States)

Published in SPIE Proceedings Vol. 3006:
Optoelectronic Integrated Circuits
Yoon-Soo Park; Ramu V. Ramaswamy, Editor(s)

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