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Proceedings Paper

High-sensitivity interferometric technique for strain measurements
Author(s): Arkady S. Voloshin; Adel F. Bastawros
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Paper Abstract

A high sensitivity strain measurement procedure that combines moire interferometry and digital image processing, has been successfully implemented to determine thermally induced strains in electronic components. The technique is called Fractional Fringe Moire Interferometry (FFMI). It produces whole field displacement information that are used to compute strains in a certain plane. Displacements in the submicron domain are detected with excellent spatial resolution over the area of interest. An example is presented here to illustrate the use of the technique to monitor thermally induced deformations in a specimen made from a plastic DIP device. The specimen was uniformly heated from room temperature to 90 degree(s)C, and the resulting moire fringe patterns were recorded, analyzed using digital-image-processing and in plane displacements in the package were determined. Strain components were then computed by simple differentiation of the acquired displacement fields. Contour maps showing actual thermo/mechanical strain components in the device were constructed. Those maps can provide an excellent tool for strain analysis of microelectronic devices regardless of the structural complexity of the device.

Paper Details

Date Published: 1 March 1991
PDF: 11 pages
Proc. SPIE 1400, Optical Fabrication and Testing, (1 March 1991); doi: 10.1117/12.26116
Show Author Affiliations
Arkady S. Voloshin, Lehigh Univ. (United States)
Adel F. Bastawros, Bethlehem Steel Corp. (United States)

Published in SPIE Proceedings Vol. 1400:
Optical Fabrication and Testing
Manfred Lorenzen; Duncan R. J. Campbell; Craig Johnson, Editor(s)

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