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Proceedings Paper

Demonstration of TC1050, encapsulated TPG graphite, as an electronic packaging material
Author(s): Mark J. Montesano
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Paper Abstract

A novel, patented technique of encapsulating high thermal conductivity TPG graphite within a structural material has been developed. This macrocomposite, named TC1050, is an ideal thermal core material because of its high thermal conductivity, low mass density, and ability to have an engineered coefficient of thermal expansion. The encapsulation technique permits the decoupling of the thermal and mechanical interdependence of the constituent materials, allowing each to be optimized independently. The thermal and mechanical performance of the TC1050 material system has been demonstrated in SEM-E, VME and custom format thermal core configurations. TC1050 thermal cores are currently in use in high thermal density airborne circuit cards such as power supplies and digital signal processors and provide three times the thermal conductivity of copper at a mass density less than aluminum.

Paper Details

Date Published: 21 November 1996
PDF: 9 pages
Proc. SPIE 2855, High Heat Flux Engineering III, (21 November 1996); doi: 10.1117/12.259837
Show Author Affiliations
Mark J. Montesano, k Technology Corp. (United States)


Published in SPIE Proceedings Vol. 2855:
High Heat Flux Engineering III
Ali M. Khounsary, Editor(s)

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