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Proceedings Paper

Nondestructive evaluation of bonding strength of silver soldered bits for civil engineering works
Author(s): Naotake Ohtsuka; Yasunori Shindo; Kuninari Miyagawa; Shigeru Kimura
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Paper Abstract

In this paper the bonding area of silver soldered tungsten cemented carbide bits was evaluated nondestructively by using electric potential and ultrasonic methods and was compared with the bonding strength measured by shearing off test. In the electric potential method, voltage was measured by changing a distance of electric terminals which were connected across the bonding plane. In the ultrasonic method, a transducer was attached to a lubricated tip surface and the amplitude of back surface echo signals was measured. It was concluded that the electric potential method is considered to be applicable as a primary nondestructive inspection of the bits by improving the configuration of tip of the terminals and applying constant contact pressure. The ultrasonic method can be used to certify the caught bits in a net of the primary inspection.

Paper Details

Date Published: 15 November 1996
PDF: 10 pages
Proc. SPIE 2948, Nondestructive Evaluation for Process Control in Manufacturing, (15 November 1996); doi: 10.1117/12.259210
Show Author Affiliations
Naotake Ohtsuka, Ryukoku Univ. (Japan)
Yasunori Shindo, Ryukoku Univ. (Japan)
Kuninari Miyagawa, Ryukoku Univ. (Japan)
Shigeru Kimura, Sun Machinery Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 2948:
Nondestructive Evaluation for Process Control in Manufacturing
Richard H. Bossi; Tom Moran, Editor(s)

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