Share Email Print
cover

Proceedings Paper

Round-robin comparison of temperature nonuniformity during RTP due to patterned layers
Author(s): Peter Vandenabeele; Karen Maex
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Temperature non-uniformity caused by patterned layers during RTP is studied experimentally in six RTP-systems from different vendors. Rapid thermal oxidation and annealing are used to indirectly measure temperature non-uniformity. A good correlation is seen with theoretical predictions. The effect of a real-live pattern with LOCOS isolation is evaluated during the growth of a thin oxide by rapid thermal oxidation. The presence of thickness variations of the grown RTO oxide in the patterned areas and at the edge of the patterned region is discussed. 1.

Paper Details

Date Published: 1 April 1991
PDF: 23 pages
Proc. SPIE 1393, Rapid Thermal and Related Processing Techniques, (1 April 1991); doi: 10.1117/12.25721
Show Author Affiliations
Peter Vandenabeele, Interuniversity Microelectronic Ctr. (Belgium)
Karen Maex, Interuniversity Microelectronic Ctr. (Belgium)


Published in SPIE Proceedings Vol. 1393:
Rapid Thermal and Related Processing Techniques
Rajendra Singh; Mehrdad M. Moslehi, Editor(s)

© SPIE. Terms of Use
Back to Top