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Proceedings Paper

Noncontacting acoustics-based temperature measurement techniques in rapid thermal processing
Author(s): Yong Jin Lee; Ching-Hua Chou; Butrus T. Khuri-Yakub; Krishna C. Saraswat
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Paper Abstract

Temperature measurement of silicon wafers based on the temperature dependence of acoustic waves is studied. The change in the temperature-dependent dispersion relations of the plate modes through the wafer can be exploited to provide a viable temperature monitoring scheme with advantages over both thermocouples and pyrometers. Velocity measurements of acoustic waves through a thin layer of ambient directly above the wafer provides the temperature of the wafer-ambient interface. 1.

Paper Details

Date Published: 1 April 1991
PDF: 6 pages
Proc. SPIE 1393, Rapid Thermal and Related Processing Techniques, (1 April 1991); doi: 10.1117/12.25719
Show Author Affiliations
Yong Jin Lee, Stanford Univ. (United States)
Ching-Hua Chou, Stanford Univ. (United States)
Butrus T. Khuri-Yakub, Stanford Univ. (United States)
Krishna C. Saraswat, Stanford Univ. (United States)


Published in SPIE Proceedings Vol. 1393:
Rapid Thermal and Related Processing Techniques
Rajendra Singh; Mehrdad M. Moslehi, Editor(s)

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