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Proceedings Paper

RTP temperature uniformity mapping
Author(s): W. Andrew Keenan; Walter H. Johnson; David T. Hodul; David Mordo
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Paper Abstract

This paper presents innovative software developed to help generate a temperature calibration curve and to mathematically manipulate and combine multi-point wafer maps. The software automatically applies the calibration curve to a map of film parameters to provide a quantitative map of temperature uniformity. Several process examples are presented to demonstrate the flexibility and convenience of the software. 1.

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1393, Rapid Thermal and Related Processing Techniques, (1 April 1991); doi: 10.1117/12.25718
Show Author Affiliations
W. Andrew Keenan, Prometrix Corp. (United States)
Walter H. Johnson, Prometrix Corp. (United States)
David T. Hodul, Varian Research Ctr. (United States)
David Mordo, AG Associates (United States)


Published in SPIE Proceedings Vol. 1393:
Rapid Thermal and Related Processing Techniques
Rajendra Singh; Mehrdad M. Moslehi, Editor(s)

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