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Proceedings Paper

Investigation of rapid thermal process-induced defects in ion-implanted Czochralski silicon
Author(s): Charles B. Yarling; Sookap Hahn; David T. Hodul; Hisaaki Suga; Walter Lee Smith
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Paper Abstract

Rapid Thermal Processing (RTP) has shown promise as a tool that will reduce the thermal budget presently used in the manufacture of advanced ULSI devices. Because of the rapid rates of temperature rise and fall coupled with inherent system temperature non-uniformities of RiP systems plastic deformation has been identified to occur in RTP- processed wafers. Concern over these types of process-induced defects has brought about the identification of various methods of uniformity characterization of RiP-processed wafers. In this study 150 mm p-type wafers (with no screen oxide) were first implanted on a batch implanter with conditions of 5E15 of arsenic at 80 keY. After implantation the wafers were rapid thermally annealed for 10 seconds at the temperatures ranging from 900 to 1250 C. Each wafer was then measured by several techniques: wafer warpage measurements optical imaging inspection (magic mirror method) X-ray transmission topography and thermal wave modulated-optical reflectance. This presentation summarizes the measured results of wafer defects and damage due to the RTP processing. 1.

Paper Details

Date Published: 1 April 1991
PDF: 8 pages
Proc. SPIE 1393, Rapid Thermal and Related Processing Techniques, (1 April 1991); doi: 10.1117/12.25704
Show Author Affiliations
Charles B. Yarling, Process Products Corp. (United States)
Sookap Hahn, Siltec Silicon (United States)
David T. Hodul, Varian Research Ctr. (United States)
Hisaaki Suga, Mitsubishi Metal Corp. (Japan)
Walter Lee Smith, Therma-Wave Inc. (United States)


Published in SPIE Proceedings Vol. 1393:
Rapid Thermal and Related Processing Techniques
Rajendra Singh; Mehrdad M. Moslehi, Editor(s)

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