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Proceedings Paper

Single-wafer integrated processing as a manufacturing tool using rapid thermal chemical vapor deposition technology
Author(s): Ahmad Kermani
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Paper Abstract

Manufacturing of advanced integrated circuits requires extreme control of ''wafer processing" induced defects from process tools manufacturing environment and manufacturing disciplines. In order to minimize handling induced defects several processing steps can be clustered into one central wafer handler with environmentally isolated wafer transfer between process modules. Unique features of Rapid Thermal Chemical Vapor Deposition (RTCVD) technology can be utilized to perform more than one processing step in a single process chamber. A number of process steps can also be clustered together to provide an application specific tool. Each process module must be effectively isolated from the wafer transfer area to eliminate cross contamination. In this paper the applications of integrated processing technology using RTCVD for MOS and bipolar based devices are discussed. The technological and economical advantages of integrated processing with a cluster tool approach are addressed. Finally the equipment requirements for such a tool in a production environment are defined. 2.

Paper Details

Date Published: 1 April 1991
PDF: 11 pages
Proc. SPIE 1393, Rapid Thermal and Related Processing Techniques, (1 April 1991); doi: 10.1117/12.25695
Show Author Affiliations
Ahmad Kermani, RAPRO Technology, Inc. (United States)

Published in SPIE Proceedings Vol. 1393:
Rapid Thermal and Related Processing Techniques
Rajendra Singh; Mehrdad M. Moslehi, Editor(s)

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