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Proceedings Paper

Proposed methodology for characterization of microroughness-induced optical scatter instrumentation
Author(s): Thomas A. Germer; Clara C. Asmail
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Paper Abstract

Measurements of optical scatter are often employed in production line diagnostics for surface roughness of silicon wafers. However, the geometry of the optical scatter instrumentation lacks universal standardization, making it difficult to compare values obtained by instruments made by different manufacturers. The bidirectional reflectance distribution function, on the other hand, is a well-defined quantity, and under conditions usually met with bare silicon wafers, can be related to the power spectral density of the surface roughness. In this paper, we present an approach for characterizing low level optical scatter instrumentation using a spatial frequency response function. Methods for calculating or measuring the response function are presented. Limitations to the validity of the spatial frequency response function are also discussed.

Paper Details

Date Published: 4 November 1996
PDF: 6 pages
Proc. SPIE 2862, Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays, (4 November 1996); doi: 10.1117/12.256204
Show Author Affiliations
Thomas A. Germer, National Institute of Standards and Technology (United States)
Clara C. Asmail, National Institute of Standards and Technology (United States)


Published in SPIE Proceedings Vol. 2862:
Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays
John C. Stover, Editor(s)

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