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Proceedings Paper

Requirements of measurement equipment for silicon wafers
Author(s): Peter Wagner; H. A. Gerber; R. Schmolke; R. Velten
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Paper Abstract

Measurement equipment for geometry, shape, surface finish of bare silicon wafers are highly sensitive tools operating partly at their capability limits. This results in performance problems which have to be solved if such equipment is to be of benefit for developing future generations of silicon wafers with specifications according to the SIA roadmap for semiconductors. The instruments for measuring the mentioned parameter belong to a class of tools the output of which is strongly influenced by their bandwidth. The requirements for future measurement equipment for specific measurement tasks as well as for generic capabilities which have to be met by all tools operating in a production ambient are outlined.

Paper Details

Date Published: 4 November 1996
PDF: 11 pages
Proc. SPIE 2862, Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays, (4 November 1996); doi: 10.1117/12.256199
Show Author Affiliations
Peter Wagner, Wacker Siltronic AG (Germany)
H. A. Gerber, Wacker Siltronic AG (Germany)
R. Schmolke, Wacker Siltronic AG (Germany)
R. Velten, Wacker Siltronic AG (Germany)


Published in SPIE Proceedings Vol. 2862:
Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays
John C. Stover, Editor(s)

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