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Proceedings Paper

Utilization of near specular energy in the detection of surface defects
Author(s): Kevin Welch
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Paper Abstract

Even though automated particle inspection sensitivities exceed 0.100 micrometers , visual inspections continue to flourish in the silicon wafer manufacturing facilities. These inspections continue due to the inability of Scanning Surface Inspection Systems (SSIS) to detect and identify a variety of wafer defects. Single integrating collection schemes have not provided sufficient information to accomplish this task. To realize full automated wafer inspection, additional inspection data must be obtained by the inspection process. Visual inspection has made great use of the near specular collection. SSISs must make use of this region. The employment of near specular inspection will greatly enhance the detection capabilities of these tools. This information must then be processed in a way to allow defect identification and sorting.

Paper Details

Date Published: 4 November 1996
PDF: 10 pages
Proc. SPIE 2862, Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays, (4 November 1996); doi: 10.1117/12.256196
Show Author Affiliations
Kevin Welch, ADE Optical Systems (United States)


Published in SPIE Proceedings Vol. 2862:
Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays
John C. Stover, Editor(s)

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