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Proceedings Paper

Silicon wafer specifications and characterization capabilities: another perspective
Author(s): Randal K. Goodall
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Paper Abstract

Models are highlighted as the key, underpinning element of specification and characterization of silicon wafers in the semiconductor industry. The role of models in interconnecting specifications, metrology, and standards across the domains of processes, equipment, and materials is described. Examples of failing models and new model approaches are provided for lithographic flatness and particle detection.

Paper Details

Date Published: 4 November 1996
PDF: 8 pages
Proc. SPIE 2862, Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays, (4 November 1996); doi: 10.1117/12.256190
Show Author Affiliations
Randal K. Goodall, SEMATECH (United States)


Published in SPIE Proceedings Vol. 2862:
Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays
John C. Stover, Editor(s)

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