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Proceedings Paper

High-density interconnect technology for VAX 9000 system
Author(s): Ujwal A. Deshpande; Gelston Howell; Shamouil Shamouilian
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Paper Details

Date Published: 1 April 1991
PDF: 13 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25614
Show Author Affiliations
Ujwal A. Deshpande, Digital Equipment Corp. (United States)
Gelston Howell, Digital Equipment Corp. (United States)
Shamouil Shamouilian, Digital Equipment Corp. (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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