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Proceedings Paper

High-density chip-to-chip interconnect system for GaAs semiconductor devices
Author(s): Stewart C. Wigginton; Scott E. Davidson; William L. Harting
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Paper Details

Date Published: 1 April 1991
PDF: 8 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25612
Show Author Affiliations
Stewart C. Wigginton, McDonnell Douglas Electronic Systems Co. (United States)
Scott E. Davidson, McDonnell Douglas Electronic Systems Co. (United States)
William L. Harting, McDonnell Douglas Electronic Systems Co. (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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