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Proceedings Paper

Quick prototyping center for hybrid-wafer-scale integration (HWSI) multichip modules
Author(s): S. Chandra; Yung-Cheng Lee
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Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25610
Show Author Affiliations
S. Chandra, Univ. of Colorado/Boulder (United States)
Yung-Cheng Lee, Univ. of Colorado/Boulder (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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