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Proceedings Paper

Quick prototyping center for hybrid-wafer-scale integration (HWSI) multichip modules
Author(s): S. Chandra; Yung-Cheng Lee
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Paper Abstract

HWSI''s impact on the size weight power cost speed and reliability of advanced systems is well recognized. Using the HWSI designers have profound opportunity to create innovative components and systems. However the HWSI so far is not accessible to most of them because of its high cost in prototyping and low-volume manufacturing. To solve this problem a proposal is being studied to develop a compact integrated prototyping center which delivers semi-custom HWSI modules within hours after the design is finished. The center conducts three major tasks: 1) fabricating interconnects by optical scanning and chemical etching 2) developing a solder mask by optical scanning and 3) soldering flip-chip assemblies by pickandplace and reflow. Through system simulation the proposed design for the center requires only eight automated units while maintaining a reasonable prototyping turn-around time (5 hours for the first module and 13 hours for a batch of 20 modules) . The corresponding packaging cost for each 1 inch square module ranges from $150 to $500 depending on the annual prototyping volume. A!

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25610
Show Author Affiliations
S. Chandra, Univ. of Colorado/Boulder (United States)
Yung-Cheng Lee, Univ. of Colorado/Boulder (United States)

Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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