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Proceedings Paper

Computer-Aided System Interconnect Design (CASID) in multipackage environment
Author(s): N. S. Chandrasehekaran; V. Sundari; Jacob V. Vengal; P. N. A. P. Rao
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Paper Details

Date Published: 1 April 1991
PDF: 14 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25606
Show Author Affiliations
N. S. Chandrasehekaran, Aeronautical Development Agency (India)
V. Sundari, Aeronautical Development Agency (India)
Jacob V. Vengal, Aeronautical Development Agency (India)
P. N. A. P. Rao, Aeronautical Development Agency (India)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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