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Proceedings Paper

Packaging issues for free-space optically interconnected multiprocessors
Author(s): Volkan H. Ozguz; Sadik C. Esener; Sing H. Lee
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Paper Abstract

The technical feasibility and the performance of packaged systems with free space optical interconnections for parallel computing are analyzed. System issues such as volume power consumption optical properties of interconnection elements yield problems and noise limitations are considered and their dependence on the existing and future technological constraints are outlined.

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25602
Show Author Affiliations
Volkan H. Ozguz, Univ. of California/San Diego (United States)
Sadik C. Esener, Univ. of California/San Diego (United States)
Sing H. Lee, Univ. of California/San Diego (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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