Share Email Print

Proceedings Paper

CAD in new areas of the package and interconnect design space
Author(s): Dennis J. McBride
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Passive interconnection networks are important for three reasons. First they represent an increasing percentage of the cycle time as the active devices are " scaled" . Second they contribute to di/dt coupled and reflected noise. Third higher clock frequencies are making the interconnection medium a more effective radiator especially in the 30 MHz to 1 GHz range where limits have been established by regulatory agencies such as the FCC. Approaches to understanding these phenomena will be highlighted.

Paper Details

Date Published: 1 April 1991
PDF: 6 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25587
Show Author Affiliations
Dennis J. McBride, IBM/Thomas J. Watson Research Ctr. (United States)

Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

© SPIE. Terms of Use
Back to Top