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Proceedings Paper

CAD in new areas of the package and interconnect design space
Author(s): Dennis J. McBride
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Paper Details

Date Published: 1 April 1991
PDF: 6 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25587
Show Author Affiliations
Dennis J. McBride, IBM/Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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