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Proceedings Paper

Photonic Multichip Packaging (PMP) using electro-optic organic materials and devices
Author(s): John F. McDonald; Nickolas P. Vlannes; Toh-Ming Lu; Gary E. Wnek; Theodore C. Nason; Lu You
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Paper Abstract

The limitations ofmetal interconnections in MultiChip Modules (MCM''s) are examined primarily with respect to their bandwidth arid propagation loss. Comparison is made with the alternative ofemploying optical interconnections. Some of the technical issues which lie ahead to make a Photonic Multichip Package (PMP) possible are explored. Certain organic materials are identified as promising candidates for implementing optical interconnections. These are found to be interesting because of their low deposition temperatures and because they lend themselves to fabrication by techniques that are already finding acceptance for metal interconnections in thin film MCM manufacturing.

Paper Details

Date Published: 1 April 1991
PDF: 16 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25584
Show Author Affiliations
John F. McDonald, Rensselaer Polytechnic Institute (United States)
Nickolas P. Vlannes, Rensselaer Polytechnic Institute (United States)
Toh-Ming Lu, Rensselaer Polytechnic Institute (United States)
Gary E. Wnek, Rensselaer Polytechnic Institute (United States)
Theodore C. Nason, Rensselaer Polytechnic Institute (United States)
Lu You, Rensselaer Polytechnic Institute (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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