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Proceedings Paper

Photonic Multichip Packaging (PMP) using electro-optic organic materials and devices
Author(s): John F. McDonald; Nickolas P. Vlannes; Toh-Ming Lu; Gary E. Wnek; Theodore C. Nason; Lu You
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Paper Details

Date Published: 1 April 1991
PDF: 16 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25584
Show Author Affiliations
John F. McDonald, Rensselaer Polytechnic Institute (United States)
Nickolas P. Vlannes, Rensselaer Polytechnic Institute (United States)
Toh-Ming Lu, Rensselaer Polytechnic Institute (United States)
Gary E. Wnek, Rensselaer Polytechnic Institute (United States)
Theodore C. Nason, Rensselaer Polytechnic Institute (United States)
Lu You, Rensselaer Polytechnic Institute (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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