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Proceedings Paper

Modeling progress and trends in electrical interconnects
Author(s): John L. Prince; Andreas C. Cangellaris; Olgierd A. Palusinski
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Paper Abstract

Technology capability in packaging interconnects has outrun the design capability. Here ''design" is used in the sense which includes setting and meeting performance metrics as well as performing geometric layout. Limitations on design capability are due in part to lack of detailed understanding of mechanisms or lack of " expertness" available to incorporate into a design system. Progress in design capability will be discussed capability gaps noted impact of drivers examined and practical examples given.

Paper Details

Date Published: 1 April 1991
PDF: 15 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25583
Show Author Affiliations
John L. Prince, Univ. of Arizona (United States)
Andreas C. Cangellaris, Univ. of Arizona (United States)
Olgierd A. Palusinski, Univ. of Arizona (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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