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Proceedings Paper

System interconnection of high-density multichip modules
Author(s): J. Peter Krusius
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Paper Abstract

Multi-chip modules (MOM) have recently received much attention because they facilitate high density and speed packaging of electronic systems. MOM''s tradeoffs are examined here for logic and memory subsystems using a newly developed package system simulation methodology. MOM''s are optimized for CMOS technologies using the simulated annealing algorithm. Parameters for optimum MOM designs are shown to separate clearly in the response space. Based on this guidelines for computer system integration with MOM''s are set up.

Paper Details

Date Published: 1 April 1991
PDF: 10 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25582
Show Author Affiliations
J. Peter Krusius, Cornell Univ. (United States)

Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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