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Proceedings Paper

System interconnect issues for subnanosecond signal transmission
Author(s): Larry L. Moresco
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Paper Abstract

A discontinuity has developed between the densities available with ULSI circuits and printed circuit board assemblies. Multichip module (MCM) technologies are poised to bridge that gap. Properly designed 3-D MCMs can deliver the compact size and high-speed of near wafer scale integration but notwithout significant electro-mechanical design challenges. This paper explores the natural constraints shaping future high speed interconnect design. 1. The Problem The transmission of subnanosecond signals alone is not difficult. Difficulties arise when one attempts to assemble multiple circuits into a system that need to transfer information at subnanosecond speeds. The system design puzzle in figure [1] depicts the problem faced by computer designers . '' Success is measured by how cost effectively one is able to interconnect and integrate the processor cache main memory data I/O cooling and the DC power system. Solutions to this challenge are evolving at a revolutionary pace. The subnanosecond pulse shown in figure [2] is representative of the information signals transferred between logic circuits of the system. Signal rise and fall times of less than 100 picoseconds are common today. One could slow down the pulse edge rise time to alleviate current switching problems while sacrificing system performance. Lowering voltage swings will also assist with the current switching demands. 2. The System Volume All the components that go into a system occupy space. Less space translates into hiher speeds and lower materials costs.

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25577
Show Author Affiliations
Larry L. Moresco, Hewlett-Packard Labs. (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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