Share Email Print
cover

Proceedings Paper

Challenges of using advanced multichip packaging for next generation spaceborne computers
Author(s): Thomas J. Moravec
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published: 1 April 1991
PDF: 7 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25576
Show Author Affiliations
Thomas J. Moravec, Honeywell, Inc. (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

© SPIE. Terms of Use
Back to Top