Share Email Print
cover

Proceedings Paper

State-of-the-art multichip modules for avionics
Author(s): John K. Hagge
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Details

Date Published: 1 April 1991
PDF: 20 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25575
Show Author Affiliations
John K. Hagge, Rockwell International Corp. (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

© SPIE. Terms of Use
Back to Top