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Proceedings Paper

Interconnection requirements in avionic systems
Author(s): Claude Vergnolle; Bruno Houssay
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Paper Abstract

The future aircraft generation will have thousand smart electromagnetic sensors distributed allover. Each sensor is connected with fibers links to the main-frame computer in charge of the real time signal''s correlation. Such a computer must be compactly built and massively parallel: it needs the use of 3 D optical free-space interconnect between neighbouring boards and reconfigurable interconnects via holographic backplane. The optical interconnect facilities will be also used to build fault-tolerant computer through large redundancy.

Paper Details

Date Published: 1 April 1991
PDF: 11 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25566
Show Author Affiliations
Claude Vergnolle, Thomson CSF/RCM (France)
Bruno Houssay, Thomson CSF/RCM (France)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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